We believe that the reliability of electronics produced by inkjet and alternative digital techniques should be underwritten by the same rigourous standards as are applied in "conventional electronics".  "Conventional electronics" is, of course, a very well established sector with highly developed requirements for function and reliability. In most cases, these requirements are specified through recognised international standards and methods. "Printed Electronics" however, has not yet had time to develop its own recognised standards and methods.
The PEL team have a wealth of experience in conventional electronics and its applicable standards and are actively applying such methods to the processes and production methods used in Printed Electronics.
an example PEL test structure
Our reliability and failure analysis facility is designed to monitor and report upon the in-field reliability of electronic and novel structures printed with inkjet and other digital techniques.
We can offer both long and short term reliability evaluations using: - Fixed Temperature (Thermal shock) and Damp-heat cycle test (Moisture resistance test)
- Migration test (Insulation resistance test)
- Electrically-biased test
- Optical Microscopy and SEM evaluation
other test methods are also available Reference Standards IPC, JIS, MIL, etc
Please do not hesitate to contact us to discuss your unique requirements | 
